Thang Long University signed a MOU with CEECVN

On Wednesday 28th March, 2018, Thang Long University and the Central and Eastern European Chamber of Commerce in Vietnam (CEECVN) signed a Memorandum of understanding.

The CEECVN delegation was represented by Mr Csaba Bundik, Vice-chairman of CEECVN, Mr. Nguyen Hai Minh, member of the Executive committee of  Mrs  Nguyen Phuong Thu, CEECVN Office manager. Thang Long University was represented by his rector, Dr. Phan Huy Phu. The vice-rector of Thang Long University, also director of the UEC-TLU center, Mr. Vu Do Quynh was also present along several members of the center.

Mr. Csaba Bundik, Vice Chairman of CEECVN and Dr Phan Huy Phú, Rector of Thăng Long University, just after signing the Memorandum of Understanding.

The signature of this MOU is the result of several exchanges between the two sides since the first meeting at the end of January 2018.  According to the MOU, both sides will put their efforts to create and develop business relationships, especially the exchange and circulation of information related to job offerings and other special events.

The signature ceremony of the MOU between the Central and Eastern European Chamber of Commerce in Vietnam and the Thang Long University  was organized on March 28, 2018 at the Thang Long University. In the bottom picture on the right side are standing, from left to right, respectively: Mrs. Nguyễn Phương Thu, Mr. Nguyễn Hải Minh, Mr. Csaba Bundik, Mr. Phan Huy Phú, Mr. Vũ Đỗ Quỳnh, Mr. Nguyễn Duy Thành and Mrs. Phạm Thị Thúy Vân.

Both sides will also create conditions for students and alumni from Thang Long University to develop their entrepreneurship and start-up spirit by interacting with the member enterprises of CEECVN, as well as with the European enterprises in Vietnam through the European Chamber of Commerce in Vietnam (Eurocham) of which CEECVN is a member.

To achieve the above goals, both sides will work together to organize each year several social events and training workshops.



Leave a Reply

Your email address will not be published. Required fields are marked *